The new MAB Model 110365 front and backside mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this new mask aligner, AMS meets the growing challenge of a dynamic semiconductor and MEMS market.
The system contains uniform lighting system with UV100 source and high resolution top and bottom side split field microscopes which lead to highly fast and highly accurate double side alignment with high resolution feature size down to 2 μm.
Table of Specification
|Mask aligner models||FEATURES|
|1-2-3-4 inch||1-2-3-4 inch||Sample size (inch)|
|1-2-4||1-2-4||Mask size (inch)
(Three mask holders)
|4 inch||4 inch||Beam size|
|Auto||Semi Auto||Exposing process|
|2µm||2µm||Minimum Feature size (Positive Tone Resist)|
|20µm||20µm||Back side- alignment stage resolution|
|3µm||XY- alignment stage resolution|
|7.5±||X||Alignment range (mm)|
|100*80||Optical Scanning movement
|TSA microscope stage (joystick)|
|1-5 mm/s||scanning speed (Joystick|
|BSA microscope stage
|100*100||Maximum Mask size ( mm×mm)
Note: for other sizes please contact us.
|0.9-2 cm||Optical Working distances|
|0.5-1-3-4 inch||Vacuum chunk for samples|
|Vacuum, Pneumatic-auto||Vacuum, Pneumatic||Mask and sample holding mechanism|
|Damping base||Anti-vibration platform|
|software, Controls, CD, Windows®(for Double side aligner models)||PC and software|
Use and Maintenance
Lithography must be done in cleanroom.
When placing the specimen or mask inside the device, be sure to use gloves and prevent any dirt inside the compartment.
Before exposure, make sure the vacuum pump is switched on and the sample is kept on the holder.
Safety and Packing
During exposure, be sure to wear UV-protective glasses and do not stare at all.
When working, keep your hair, hands and clothes away from mechanical parts.
Do not wet the instrument’s electrical parts.
Avoid moving the device when the lamp is still hot.